Services
Failure & Technology Analysis
If products or single components fail, we will find out the root cause as quickly as possible, so that the error can be solved at an early stage to avoid further damage. With our services we test the quality and reliability of components, assemblies, systems and power electronics. In this way, we help you to analyse the failure precisely and define suitable measures. We are experts for the following procedures:
Non-destructive testing
X-ray microscopy is a standard procedure for non-destructive testing of components and assemblies. Typical analyses are the solder joint evaluation with void calculation, analyses of the internal structure of components according to international standards and the support of destructive analyses.
Using X-ray CT, a three-dimensional data set of the investigated object is generated, which can later be comprehensively analysed. X-ray CT is particularly suitable for the analyses of complex embedded or encapsulated systems.
A scanning acoustic microscope can be used to quickly and effectively inspect the interior of components for delamination, cracks or other damages.
The visual inspection is a classic non-destructive method, which is used especially for solder joint inspection.
Whiskers, i. e. needle-shaped crystals, can be formed in electronic assemblies after a short time and lead to short-circuits. Whisker tests enable us to identify potential hazards at an early stage and prevent damage.
Materials analyses
We prepare high-quality cross-sections of printed circuit boards, electronic assemblies, metallic parts and individual electronic components which we evaluate with the aid of various microscopic methods; stereo-microscope, light microscope (bright and dark field, polarized, UV) and scanning electron microscopy. This enables us to analyse errors and failures in your product or components with the utmost precision.
We use a contaminometer to measure contamination on printed circuit boards and assemblies. These impurities are often the reason why protective coatings on electronic components loosen or develop cracks. This also leads to migrations and dendrites, which can lead to leakage currents and thus to malfunctions. We offer qualification and appropriate tests to prevent or detect such impurities.
With the scanning electron microscope, in short SEM, we can examine your product or components in detail with very high resolution. In addition, we offer energy dispersive X-ray spectroscopy (EDX) to perform elemental analyses.
