Services
Wafer and
Device Testing
Test Operations
In Nördlingen, we perform mechanical, climatic, electrical and optoelectronic testing using state-of-the-art equipment. Depending on your requirements, testing can be carried out under grey room conditions or in clean room environments up to ISO Class 6 (Class 1000) prior to product assembly.
- Wafer level testing (6 to 12 inch wafer and frame)
- AOI (Automated Optical Inspection) of wafers
- Package level testing using automated handling systems
- Manual package level testing for prototypes and low-volume production
- High-voltage testing of power modules and on wafer level
- Test at temperature
- wafer: -60°C to 200°C
- package: -55°C to 155 °C
- Screening and reliability-related testing
- End-of-line services
- Scanning & Straightening
- Tape & Reel
- High-temperature storage
- Environmental stress testing
Test Engineering
Our experienced test engineers develop custom specific test solutions for a broad range of semiconductor and electronic products, including passive components, discrete semiconductors, analog and digital ICs, power modules and complex mixed-signal ASICs. From Design for Testability (DFT) support and test specification development to characterization, qualification and production ramp-up, we help customers achieve reliable and cost-efficient test coverage throughout the entire product lifecycle.
- Development of test concepts
- Support for Design for Testability (DFT)
- Support in the creation of test specifications
- Development of test software and hardware for analog, digital, mixed signal , RF devices as well as power modules
- Characterization
- Test program conversion
- Test data analysis
- Test optimisation and test time reduction
- Development of electrical tests for qualification and failure analysis
Device Programming
By using modern handling systems we can customize your components according to your requirements. Programming with fully automatic machines is possible up to 16 devices simultaneously.
